Excimer lasers are widely used in semiconductor and microelectronics applications where high-resolution patterning, mask inspection, reticle inspection, and thin-film processing are required. Their ultraviolet wavelengths enable non-thermal material interaction, allowing precise imaging, cleaning, and lift-off with minimal collateral effects.
Excimer Lasers for Semicon Equipment & Microelectronics
MLase develops compact, low- to mid-power UV laser sources for integration into advanced semiconductor and microelectronics equipments. These lasers deliver stable, nanosecond-scale pulses across 193 nm, 248 nm, and 308 nm wavelengths, providing precise ultraviolet illumination for photomask and reticle inspection, R&D lithography, aerial imaging, particle cleaning, and thin-film lift-off applications. With consistently high pulse-to-pulse stability and reliable beam quality, MLase lasers support repeatable performance in laboratory, pilot, and OEM development workflows.
Their small footprint and flexible design enable integration into optical metrology platforms, prototype lithography setups, and specialized thin-film processing systems, ensuring precise material interaction while preserving delicate structures.
Excimer Lasers in Inspection, Lithography, and Thin-Film Processing
MLase develops compact excimer laser sources for integration into advanced semiconductor and microelectronics systems, including photomask inspection, R&D lithography, aerial imaging, and thin-film lift-off platforms.
With stable pulse energy, nanosecond-scale operation, and consistent beam quality, these lasers support repeatable results across laboratory, pilot, and OEM development workflows. Their low- to mid-power design provides flexibility for diverse DUV processes while maintaining high stability and reliability in demanding microelectronics applications.
DUV Photomask and Reticle Inspection
High-resolution inspection of photomasks and reticles requires precise ultraviolet illumination to detect defects such as particles, scratches, or critical dimensions (CD) deviations. 193 nm excimer lasers deliver stable, short-wavelength pulses that enable accurate defect identification on both blank and patterned masks.
Patterned-mask inspection often employs Reticle-Plane Imaging (RPI), projecting the mask image onto a detector for digital evaluation. The short-wavelength 193 nm light interacts strongly with mask materials, producing high contrast between defects and background. Excimer lasers deliver stable, nanosecond-scale pulses that maintain consistent illumination, supporting high-throughput inspection pipelines.
These sources are industry-proven for DUV inspection and related metrology applications, including critical dimension (CD) measurement and aerial imaging. Optional 248 nm wavelengths can be used for coarser structures or older nodes, complementing the 193 nm standard.
MLase GmbH develops compact excimer laser sources with high pulse-to-pulse stability and robust beam quality, enabling reliable integration into semiconductor inspection systems and advanced metrology platforms.
Precision Laser Cleaning of Photomasks, Reticles and Pellicles
Particle and residue removal on photomasks and reticles requires highly controlled, nonthermal energy delivery. 193 nm excimer pulses enable laser surface cleaning by selective laser ablation of contaminants while preserving delicate substrates and absorber structures.
Laser cleaning leverages photochemical absorption of contaminants, allowing selective removal of particles and residues without damaging the underlying mask or pellicle. In typical workflows, particle locations are first identified by dedicated measurement systems, and the excimer laser is then used for precise laser ablation of the contamination at these locations.
High pulse stability and nanosecond-scale operation ensure repeatable, controlled material removal, supporting integration into industrial mask- and reticle-cleaning platforms that are widely established in semiconductor manufacturing. Optional 248 nm operation can be used for less critical residues, complementing the 193 nm standard.
MLase GmbH develops excimer laser sources designed for integration into advanced photomask and reticle laser cleaning systems, delivering stable pulse energy and consistent beam profiles for precise, repeatable cleaning processes.
Aerial Imaging for Reticle Pattern Verification
Evaluating reticle performance in conditions that replicate lithography scanners requires precise UV illumination. 193 nm excimer lasers generate high-fidelity aerial images for assessing critical dimensions, phase-shift features, and mask error enhancement factors.
Excimer lasers act as a stable UV light source, delivering high-quality 193 nm UV pulses that are compatible with advanced optical metrology platforms. Their stability and reproducibility support precise evaluation of reticle patterns under scanner-like illumination conditions, enabling accurate assessment of feature fidelity and lithography performance. These laser sources are widely used in DUV lithography simulation tools and integrate reliably into established aerial imaging setups for mask verification.
MLase GmbH develops excimer UV light source systems with stable output and precise beam control, enabling integration into advanced reticle imaging platforms and high-precision optical lithography metrology systems.
R&D Lithography and Process Development
Compact excimer lasers deliver ultraviolet illumination for research- and prototype-scale lithography, enabling high-resolution patterning and precise UV exposure of photoresists in academic, laboratory, or small-volume semiconductor environments.
These lasers offer stable, nanosecond-scale pulses at 193 nm or 248 nm, matching standard lithography exposure wavelengths and ensuring consistent resist profiles across experiments. Their small-footprint, low-power design makes them ideal for R&D tools, teaching platforms, and prototype development, where repeatable UV exposure is critical.
As a stable UV light source, excimer sources support a variety of lithographic coatings and photoresists while remaining compatible with research-grade optical setups. They are not intended for high-power production tools, but excel in laboratory, academic, or pilot-scale environments where flexibility, precision, and stability are paramount.
MLase GmbH develops excimer laser sources optimized for integration into R&D lithography and academic photonics systems, delivering consistent UV illumination for experiments, prototyping, and teaching applications.
Laser Debonding and Lift-Off Processes
Precise separation of thin functional layers from transparent substrates relies on controlled UV energy delivery. Excimer lasers enable clean laser lift-off (LLO) of OLED stacks, flexible electronics, or semiconductor films without mechanical stress or damage to sensitive structures.
In LLO processes, the laser delivers targeted UV pulses to the interface between the substrate and the functional layer. Due to the shallow penetration depth of deep-UV light, the energy selectively breaks the bond, enabling controlled layer removal. Compact excimer sources are suitable for small-area debonding in R&D, pilot, or OEM development platforms, supporting thin-film semiconductor and display workflows.
The lasers provide stable, nanosecond-scale pulses at 248 nm, allowing consistent energy deposition and repeatable results for energy densities in the range of ~200–300 mJ/cm² over mm-scale areas.
MLase GmbH develops excimer laser sources optimized for integration into lift-off and debonding test setups, delivering controlled UV pulses for precise thin-film separation while preserving the integrity of underlying substrates.
Technology Advantages
Our Commitment to Quality
MLase operates as a medical device manufacturer with a quality management system certified according to ISO 13485/ EN ISO 13485. Our products are developed and manufactured to meet the highest standards of performance, reliability, and quality.
This commitment ensures that our excimer laser systems support safe and dependable operation in demanding medical applications.
Learn about our technology, company, products, and OEM partnership model
- MLI Series of industrial standard excimer lasers with 193 nm and 248 nm
- Multiple optics, power and cooling configurations
- Enabling fast adaptions to application or marktes
- Understand our OEM Partnership Model
- Typical integration elements
- Infrastructure supporting scalable volume-requirements
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