Excimer lasers enable highly precise material processing where micro-scale features must be created without thermal distortion. Their deep-UV wavelengths allow controlled removal of polymers, glass, coatings, and other engineered materials used in advanced manufacturing.
MLase Excimer Lasers for Micromachining
MLase GmbH develops compact and high-stability excimer laser sources designed for integration into advanced micromachining platforms. Our systems deliver stable deep-UV pulses that support precise and repeatable micro-structuring across a wide range of industrial materials.
MLase excimer lasers enable processes such as micro-drilling, precision surface structuring, UV marking, and selective removal of polymer coatings. High pulse stability, homogeneous beam profiles, and repetition rates up to the kilohertz range ensure reliable performance in demanding manufacturing environments.
Precision Micromachining Applications
Excimer lasers support a range of industrial micromachining processes requiring high precision and minimal thermal impact. Typical applications include fine wire stripping, fabrication of microfluidic structures, precision cleaning of sensitive surfaces, high-resolution UV marking, and micro-drilling or structuring of functional materials.
Fine Wire Stripping using UV Laser Ablation
Excimer-based UV systems enable precise insulation removal from ultra-fine conductors through controlled laser ablation. This approach allows highly accurate wire stripping of polymer coatings without damaging the underlying metal core. Because the interaction occurs in the deep-UV spectral range, the process enables clean, non-contact removal of dielectric layers used on medical wires, sensors, neurostimulation leads, and micro-electronic assemblies.
During precision wire stripping, excimer laser pulses are strongly absorbed by many insulation materials. Short ultraviolet pulses can therefore remove coatings such as polyimide, ETFE, PTFE, PFA, polyurethane, or enamel while leaving the metallic conductor intact. This laser ablation mechanism is predominantly photochemical rather than thermal, ensuring that the metal core remains free from heat damage or mechanical stress.
This material interaction enables reliable processing of extremely small wire diameters where conventional mechanical wire stripping techniques would risk conductor damage. Through selective ablation, the UV laser removes only the insulation layer while preserving the surrounding material. The process produces sharp edges and highly repeatable strip lengths even on wires smaller than 40 AWG.
Excimer-based laser ablation is therefore widely used in the manufacturing of implantable medical leads, catheter wires, micro-sensors, and precision electronic assemblies where controlled insulation removal is required before welding, bonding, or electrical interconnection.
Microfluidic and Lab-on-Chip Fabrication
Excimer lasers enable precise micromachining of polymer substrates used in microfluidic devices and lab-on-chip systems. Deep-UV pulses allow controlled laser ablation of polymer materials, enabling the fabrication of fine microchannels, micro-holes, and functional structures required for accurate fluid handling in diagnostic and life science applications.
In microfluidic device fabrication, excimer lasers are used to produce high-precision features such as microchannels, via holes, and fluidic distribution structures in polymer substrates. The deep-UV wavelengths interact strongly with many polymer materials, enabling clean laser ablation with minimal thermal impact on surrounding structures.
The same UV processing approach can also be applied for micro-hole drilling and precision laser drilling of fluidic inlet and outlet ports. This allows dense arrays of micro-holes and finely structured channel geometries to be created with high repeatability. Such structures are commonly used in reagent distribution plates, diagnostic cartridges, and lab-on-chip platforms designed for analytical instrumentation and life-science research.
Because ultraviolet laser ablation removes material through a predominantly photochemical mechanism, the process introduces minimal thermal load and avoids melting or mechanical stress. This makes excimer lasers particularly suitable for precision micro-structuring of thin polymer films and multilayer substrates used in microfluidic systems.
MLase GmbH develops compact excimer laser sources designed for integration into micromachining platforms used in polymer processing and micro-device fabrication. Stable ultraviolet pulses and homogeneous beam profiles support reliable laser ablation, micro-hole drilling, and laser drilling processes for advanced microfluidic manufacturing.
High-Resolution UV Laser Marking
Permanent identification and micro-scale surface features can be created by removing extremely thin material layers from glass, polymers, and coated components. Deep-UV laser marking enables high-contrast features while avoiding cracks, melting, or thermal stress.
Excimer laser marking uses photochemical ablation to generate shallow engravings and micro-structured features on sensitive materials. The short wavelengths of excimer lasers interact strongly with many transparent and polymer materials, allowing precise removal of ultra-thin surface layers.
This enables crisp, micron-scale markings on glass components, optical elements, polymer parts, and coated surfaces. Because the process introduces very little heat into the material, it prevents deformation, micro-cracking, or coating damage that can occur with conventional marking technologies.
Typical applications include traceability markings on optical components, semi-visible markings on lenses, identification features on precision parts, and shallow micro-structures used in advanced manufacturing.
MLase GmbH develops compact excimer laser sources that integrate into high-precision marking systems. Stable pulse energy and homogeneous beam profiles support consistent mark quality and repeatable micro-structuring in industrial production environments.
Precision UV Laser Cleaning of Sensitive Surfaces
Sensitive components often require the removal of organic residues, particles, or thin surface films without mechanical contact or chemical solvents. Deep-UV laser cleaning based on controlled laser ablation provides a precise method to eliminate contamination while preserving delicate materials and coatings.
UV excimer cleaning relies on photochemical bond breaking to remove organic contamination layers from material surfaces. High-energy photons at 193 nm and 248 nm break molecular bonds in residues, enabling selective removal of thin films with minimal thermal impact on the underlying substrate.
Because the interaction depth of deep-UV radiation is very shallow, the process is well suited for cleaning sensitive materials such as optical components, composite materials including CFRP, and precision metal parts used in advanced manufacturing.
Typical applications include preparation of optical surfaces before coating processes, removal of organic residues from precision components, and surface preparation of composite materials prior to bonding or assembly.
MLase GmbH develops compact excimer laser sources designed for integration into automated UV cleaning platforms. Stable pulse energy and homogeneous beam profiles support reliable, repeatable removal of surface contamination in industrial production environments.
UV Micromachining, Structuring and Micro-Drilling
Many advanced components require micro-scale structures such as holes, channels, or functional surface patterns that must be produced without thermal distortion. Deep-UV laser micromachining enables precise material removal for these structures while maintaining excellent edge quality and dimensional control.
Excimer lasers are widely used for precision micromachining where extremely small features and minimal thermal impact are required. Their deep-UV wavelengths enable photochemical ablation, allowing thin layers of material to be removed with high accuracy and minimal heat-affected zones.
This makes excimer processing particularly effective for polymers, thin coatings, glass, and engineered materials used in advanced manufacturing. Typical processes include micro-drilling of small holes, fabrication of fine channels or apertures, and shallow surface structuring used to modify adhesion, wetting, or bonding characteristics.
Examples range from micro-features in medical polymer components and precision surface textures to fine via formation in thin glass substrates and other micro-structured functional surfaces.
MLase GmbH develops compact excimer laser sources designed for integration into industrial micromachining platforms. Stable pulse energy, homogeneous beam profiles, and repetition rates up to the kilohertz range enable reliable production of high-precision micro-features across a wide range of materials.
Technology Advantages
Our Commitment to Quality
MLase operates as a medical device manufacturer with a quality management system certified according to ISO 13485/ EN ISO 13485. Our products are developed and manufactured to meet the highest standards of performance, reliability, and quality.
This commitment ensures that our excimer laser systems support safe and dependable operation in demanding medical applications.
Learn about our technology, company, products, and OEM partnership model
- MLI Series of industrial standard excimer lasers with 193 nm and 248 nm
- Multiple optics, power and cooling configurations
- Enabling fast adaptions to application or marktes
- Understand our OEM Partnership Model
- Typical integration elements
- Infrastructure supporting scalable volume-requirements
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