Optics, Photonics & Telecommunication

During FBG writing, ultraviolet light is projected onto e.g. pure, germanium- or gallium-doped silica fibers through a phase mask or interferometric optical setup. The resulting interference pattern produces a periodic refractive index modification in the fiber core, forming a Fiber Bragg Grating that reflects specific optical wavelengths while transmitting others. These gratings serve as key components in telecom networks, laser resonators, and precision sensing systems.

Excimer lasers operating at 248 nm or 193 nm are widely used for this process because deep-UV photons efficiently induce permanent index changes in the fibers. The short wavelengths enable strong material coupling and high photosensitivity, allowing accurate control of grating strength, spectral bandwidth, and center wavelength. Both phase-mask production systems for high-volume telecom components and interferometric FBG writing setups for specialty gratings rely on stable ultraviolet pulse energy and uniform beam profiles to ensure consistent grating quality.

As a result, excimer-based Fiber Bragg Grating inscription has become a mature industrial technology used in wavelength-division multiplexing filters, pump stabilization elements, gain-flattening filters, distributed sensing arrays, and precision photonic devices.

MLase GmbH develops compact excimer laser sources that integrate into automated FBG writing systems used in telecommunications manufacturing, photonics research, and optical sensing development. With stable millijoule-class pulse energies and repetition rates up to kilohertz operation, these lasers support both high-throughput phase-mask production systems and flexible interferometric setups for specialty gratings and advanced sensing architectures.

Within optical laboratories and industrial metrology platforms, deep-UV illumination enables highly sensitive optics testing and sensor evaluation. A reliable UV light source allows engineers to identify surface defects, investigate material responses, and assess optical performance that cannot be detected using visible wavelengths. Excimer lasers operating at 193 nm and 248 nm generate intense ultraviolet pulses that support high-resolution inspection of optical substrates, coatings, photomasks, sensors, and micro-optical structures.

Short-wavelength UV light source systems provide uniform illumination of optical surfaces and microstructures, enabling coating characterization, transmission analysis, contamination detection, and detailed optics testing of photonic devices.

Many optical materials interact strongly with deep-UV radiation through absorption or scattering mechanisms. As a result, excimer-based illumination can expose nanoscale surface defects, subsurface damage, and coating irregularities that remain undetectable at longer wavelengths. These capabilities are widely applied in photonics research, semiconductor inspection, and optical manufacturing quality control.

MLase GmbH develops compact excimer-based UV light source systems designed for integration into optical test benches, metrology platforms, and scientific instrumentation. Their stable pulse energy and reliable ultraviolet emission enable consistent illumination for high-precision optics testing and optical characterization in both laboratory and industrial environments.

In precision glass marking, a UV laser creates shallow micro-structures or engraved patterns on transparent substrates such as glass optics, ophthalmic lenses, polymer optical components, and coated materials. The process relies on controlled laser ablation, where only a thin surface layer is removed while the surrounding material remains unaffected. This enables the creation of crisp identification marks, serial numbers, brand inscriptions, alignment features, or shallow diffractive patterns.

Deep-UV wavelengths such as 193 nm and 248 nm are particularly effective because glass and many optical polymers exhibit strong absorption in this spectral range. The resulting photochemical interaction produces highly controlled surface modification with minimal thermal load, preventing cracking, melting, or coating damage even on delicate or precision-polished optical surfaces.

Excimer-based glass marking is therefore widely used in optical manufacturing, including semi-visible markings on ophthalmic lenses, identification features on precision optical components, and micro-structured markings on glass substrates used in sensing or photonic devices.

MLase GmbH develops compact UV laser sources that integrate into precision glass marking systems used in optics manufacturing, micro-machining, and medical device production. With stable ultraviolet pulse energies, homogeneous beam profiles, and repetition rates up to kilohertz operation, these lasers support high-contrast optical markings and shallow micro-structuring on glass and polymer components while maintaining the crack-free surface quality required for optical applications.

In waveguide fabrication, excimer lasers are used to locally modify optical materials or create shallow surface structures that guide light within a defined path. Depending on the process design, ultraviolet exposure can induce controlled refractive-index changes or generate precisely patterned channel structures in thin photonic layers through selective ablation of the material.

Deep-UV wavelengths such as 193 nm and 248 nm interact strongly with many photonic materials, enabling highly localized processing with minimal thermal impact. These photochemical interactions support highly controlled laser ablation processes that preserve the surrounding material while forming precise micro-structures.

Similar ultraviolet mechanisms are also used in fiber Bragg grating inscription, where UV exposure permanently modifies the optical properties of silica fibers. In planar photonic platforms, these interactions can be applied to form integrated waveguide structures and optical routing elements. Excimer-based processing is therefore widely used in the development of planar lightwave circuits, integrated optical sensors, and photonic device platforms where precise UV exposure and stable beam profiles are required.

MLase GmbH develops compact excimer laser sources that integrate into photonic processing platforms for optical waveguide fabrication and prototyping. Stable millijoule-class ultraviolet pulses and homogeneous beam profiles support mask-based exposure systems, selective ablation, and precision UV patterning used in advanced photonic device manufacturing.

Fine wire stripping with excimer lasers relies on the strong ultraviolet absorption of many polymer insulation materials. Short UV pulses remove thin coatings such as polyimide, ETFE, PTFE, PFA, polyurethane, or enamel while leaving the metallic conductor unaffected. Because the process is photochemical rather than thermal, the metal core remains undamaged and free of mechanical stress.

This selective interaction makes excimer lasers particularly well suited for very small wire diameters where mechanical wire stripping or thermal methods would risk conductor damage. The UV-driven laser stripping process produces clean edges and highly reproducible strip lengths even on wires smaller than 40 AWG. Excimer-based stripping is widely used in the production of implantable medical leads, micro-sensors, and precision electronic assemblies where reliable insulation removal is required prior to welding, bonding, or electrical connection.

MLase GmbH develops compact excimer laser systems that integrate into automated wire stripping platforms for high-precision insulation removal. Stable ultraviolet pulses and uniform beam delivery support reproducible laser stripping of delicate fine wires in both medical device manufacturing and high-reliability electronic assemblies.