Material Transformation & Separation

During FBG writing, ultraviolet light is projected onto e.g. pure, germanium- or gallium-doped silica fibers through a phase mask or interferometric optical setup. The resulting interference pattern produces a periodic refractive index modification in the fiber core, forming a Fiber Bragg Grating that reflects specific optical wavelengths while transmitting others. These gratings serve as key components in telecom networks, laser resonators, and precision sensing systems.

Excimer lasers operating at 248 nm or 193 nm are widely used for this process because deep-UV photons efficiently induce permanent index changes in the fibers. The short wavelengths enable strong material coupling and high photosensitivity, allowing accurate control of grating strength, spectral bandwidth, and center wavelength. Both phase-mask production systems for high-volume telecom components and interferometric FBG writing setups for specialty gratings rely on stable ultraviolet pulse energy and uniform beam profiles to ensure consistent grating quality.

As a result, excimer-based Fiber Bragg Grating inscription has become a mature industrial technology used in wavelength-division multiplexing filters, pump stabilization elements, gain-flattening filters, distributed sensing arrays, and precision photonic devices.

MLase GmbH develops compact excimer laser sources that integrate into automated FBG writing systems used in telecommunications manufacturing, photonics research, and optical sensing development. With stable millijoule-class pulse energies and repetition rates up to kilohertz operation, these lasers support both high-throughput phase-mask production systems and flexible interferometric setups for specialty gratings and advanced sensing architectures.

In waveguide fabrication, excimer lasers are used to locally modify optical materials or create shallow surface structures that guide light within a defined path. Depending on the process design, ultraviolet exposure can induce controlled refractive-index changes or generate precisely patterned channel structures in thin photonic layers through selective ablation of the material.

Deep-UV wavelengths such as 193 nm and 248 nm interact strongly with many photonic materials, enabling highly localized processing with minimal thermal impact. These photochemical interactions support highly controlled laser ablation processes that preserve the surrounding material while forming precise micro-structures.

Similar ultraviolet mechanisms are also used in fiber Bragg grating inscription, where UV exposure permanently modifies the optical properties of silica fibers. In planar photonic platforms, these interactions can be applied to form integrated waveguide structures and optical routing elements. Excimer-based processing is therefore widely used in the development of planar lightwave circuits, integrated optical sensors, and photonic device platforms where precise UV exposure and stable beam profiles are required.

MLase GmbH develops compact excimer laser sources that integrate into photonic processing platforms for optical waveguide fabrication and prototyping. Stable millijoule-class ultraviolet pulses and homogeneous beam profiles support mask-based exposure systems, selective ablation, and precision UV patterning used in advanced photonic device manufacturing.

These lasers offer stable, nanosecond-scale pulses at 193 nm or 248 nm, matching standard lithography exposure wavelengths and ensuring consistent resist profiles across experiments. Their small-footprint, low-power design makes them ideal for R&D tools, teaching platforms, and prototype development, where repeatable UV exposure is critical.

As a stable UV light source, excimer sources support a variety of lithographic coatings and photoresists while remaining compatible with research-grade optical setups. They are not intended for high-power production tools, but excel in laboratory, academic, or pilot-scale environments where flexibility, precision, and stability are paramount.

MLase GmbH develops excimer laser sources optimized for integration into R&D lithography and academic photonics systems, delivering consistent UV illumination for experiments, prototyping, and teaching applications.

In LLO processes, the laser delivers targeted UV pulses to the interface between the substrate and the functional layer. Due to the shallow penetration depth of deep-UV light, the energy selectively breaks the bond, enabling controlled layer removal. Compact excimer sources are suitable for small-area debonding in R&D, pilot, or OEM development platforms, supporting thin-film semiconductor and display workflows.

The lasers provide stable, nanosecond-scale pulses at 248 nm, allowing consistent energy deposition and repeatable results for energy densities in the range of ~200–300 mJ/cm² over mm-scale areas.

MLase GmbH develops excimer laser sources optimized for integration into lift-off and debonding test setups, delivering controlled UV pulses for precise thin-film separation while preserving the integrity of underlying substrates.